Copper Clad Polyimide Film Single Side FCCL Sheet for FPC Board Assembly

Short Description:

Copper Clad Polyimide Film uses amber or black polyimide film as base film and plated with copper foil tape. It’s usually used together with thermosetting coverlay film on Flexible Printed Circuits boards industry, featuring excellent high temperature resistance and insulation performance. The soldering resistance temperature is 288℃ without bubbles and delamination. We have complete series products of PI base FCCL and polyimide thermosetting coverlay and polyimide stiffener sheet, which can provide professional solutions for FPC Board assembly or other heat resistance and electrical insulation manufacturing industry.

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Features：

1. Good shear resistance

2. Soldering resistance temperature is 288℃

3. Excellent chemical stability ,

4. Radiation resistance,

5. Chemical solvent resistance and anti-corrosion

6. Easy to die-cut in any custom shape design

7. High class electrical insulation

8. Thermosetting adhesive

9. Smooth finish, no bubbles and delamination

FPC flexible circuit board is usually bonded with thermosetting adhesive film and polyimide stiffener plate. The thermosetting adhesive film is without viscosity while solid at normal temperature, but when the temperature rises to a certain range, it will change into a semi-solidified state with strong viscosity. At this time, FPC will stick to the polyimide stiffener plate. The general practice is to align the PI stiffener fit to a right position, and use the electric soldering iron for 1~2 seconds to fix the single point position. After high temperature and high pressing, the whole surface would be completely bonding, then baking the film to cure the adhesive.