Copper Clad Polyimide Film Single Side FCCL Sheet ya FPC Board Assembly

Kufotokozera Kwachidule:

Filimu ya Copper Clad Polyimideamagwiritsa ntchito filimu ya amber kapena yakuda ya polyimide ngati filimu yoyambira ndikukutidwa ndi tepi yachitsulo yamkuwa.Nthawi zambiri amagwiritsidwa ntchito limodzi ndi filimu yophimba ya thermosetting pamakampani opanga ma Flexible Printed Circuits boards, omwe amakhala ndi kukana kutentha kwambiri komanso magwiridwe antchito.Kutentha kwa soldering kukana ndi 288 ℃ popanda thovu ndi delamination.Tili ndi zinthu zathunthu za PI base FCCL ndi polyimide thermosetting coverlay ndi polyimide stiffener sheet, zomwe zitha kupereka mayankho aukadaulo pa msonkhano wa FPC Board kapena kukana kutentha kwina ndi mafakitale opanga magetsi.

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Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Mawonekedwe:

1. Kukana kukameta ubweya wabwino

2. Kutentha kwa kutentha kwa kutentha ndi 288 ℃

3. Kukhazikika kwamphamvu kwamankhwala,

4. Kukana kwa radiation,

5. Chemical zosungunulira kukana ndi odana ndi dzimbiri

6. Zosavuta kufa-kudula mumapangidwe amtundu uliwonse

7. Kutsekemera kwamagetsi kwapamwamba

8. Thermosetting zomatira

9. Mapeto osalala, opanda thovu ndi delamination

FPC flexible circuit board nthawi zambiri imamangiriridwa ndi zomatira za thermosettingkanemandipolyimide stiffenermbale.Thermosetting zomatirakanemais popanda mamasukidwe akayendedwecholimba pa kutentha kwabwino, koma kutentha kukakwera kufika pamlingo winaosiyanasiyana, izo zidzasintha kukhala theka-okhazikika boma ndi mamasukidwe akayendedwe amphamvu.Panthawiyi, FPC idzamamatira kupolyimide stiffenermbale.Mchitidwe ambiri ndi agwirizane ndiPI stiffener oyenera kumanjaudindo, ndi ntchito magetsisolderingchitsulo kwa 1 ~ 2 masekondi kutikonzasingle point position.Pambuyo pa kutentha kwakukulu ndi kusindikiza kwakukulundi, padziko lonseadzakhalakugwirizana kwathunthu,ndiyekuphikafilimu kuchiritsa zomatira.