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  • Leqephe la Letlapa la Copper Clad Polyimide le Leng Lehlakoreng la FCCL bakeng sa Kopano ea Boto ea FPC

    Tlhaloso e Khutšoanyane:

     

    Filimi ea Copper Clad Polyimidee sebelisa filimi ea amber kapa e ntšo ea polyimide e le filimi ea motheo 'me e pentiloe ka tepi ea koporo.Hangata e sebelisoa hammoho le filimi ea sekoaelo sa thermosetting indastering ea liboto tsa Flexible Printed Circuits, e nang le ts'ebetso e ntle haholo ea ho hanyetsa mocheso o phahameng le ts'ebetso ea insulation.Mocheso oa ho hanyetsa oa soldering ke 288 ℃ ntle le li-bubble le delamination.Re na le lihlahisoa tse felletseng tsa PI base FCCL le polyimide thermosetting coverlay le polyimide stiffener sheet, tse ka fanang ka tharollo ea litsebi bakeng sa kopano ea FPC Board kapa indasteri e 'ngoe ea ho hanyetsa mocheso le indasteri ea tlhahiso ea ho kenya motlakase.


    Lintlha tsa Sehlahisoa

    Li-tag tsa Sehlahisoa

    Likaroloana:

    1. Ho hanyetsa ho kuta hantle

    2. Mocheso oa ho hanyetsa mocheso ke 288 ℃

    3. E babatsehang botsitso ba lik'hemik'hale ,

    4. Ho hanyetsa mahlaseli,

    5. Khanyetso ea solvent ea lik'hemik'hale le anti-corrosion

    6. Ho bonolo ho shoa-seha ka mokhoa ofe kapa ofe oa sebopeho sa tloaelo

    7. Motlakase o phahameng oa sehlopha se phahameng

    8. Sekhomaretsi sa thermosetting

    9. Qetello e boreleli, ha ho bubble le delamination

    filimi ea polyimide

    FPC flexible circuit board hangata e hokahanngoa le sekhomaretsi sa thermosettingfilimilepolyimide stiffenerpoleiti.Sekhomaretsi sa thermosettingfilimiis ntle le viscosity ha a ntse atiileng mochesong o tlwaelehileng, empa ha mocheso o nyolohela ho ntho e itsengmefuta-futa, e tla fetoha boemo bo tiileng bo nang le viscosity e matla.Ka nako ena, FPC e tla khomarelapolyimide stiffenerpoleiti.Tloaelo e akaretsang ke ho ikamahanya lePI stiffener e loketseng ho le letonaboemo, le ho sebelisa motlakaseho sodisatšepe bakeng sa metsotsoana e 1 ~ 2 holokisa eaboemo ba ntlha e le 'ngoen.Ka mor'a mocheso o phahameng le khatello e phahamengng, bokaholimo bohlee ka bakopano e feletseng,ebeho bakafilimi ho phekola sekgomaretsi.

    Boemo ba ts'ebetso ea filimi ea koporo ea polyimide kapa letlapa la polyimide stiffener:

    1. Sehlopha sa pele: mocheso 120 ℃, khatello e phahameng ea 20kg / cm², 1min;

    2. Sehlopha sa bobeli: mocheso 140 ℃, khatello e phahameng ea 30kg / cm², 80min;

    3. Sehlopha sa boraro: mocheso 80 ℃,khatello e phahameng 30kg/ cm², 5min;

     

    Kopo:

    Kopano ea boto ea FPC

    PCB Board tlhahiso

    Coverlay kapa Stiffener ho F-PCB.

    Kopano ea boto ea potoloho ea likoloi

    Transformer le Motor Insulation.


  • E fetileng:
  • E 'ngoe: