Kiʻiʻoniʻoni Copper Clad Polyimide Film ʻaoʻao hoʻokahi FCCL Pepa no ka FPC Board Assembly

Kiʻiʻoniʻoni Copper Clad Polyimide ʻO ka ʻaoʻao hoʻokahi FCCL Pepa no ka FPC Board Assembly Kiʻi ʻia

ʻO ka wehewehe pōkole:

Kiʻiʻoniʻoni Polyimide ʻAʻahu keleawehoʻohana i ka kiʻiʻoniʻoni polyimide amber a ʻeleʻele paha ma ke ʻano he kiʻiʻoniʻoni kumu a hoʻopaʻa ʻia me ka lipine copper foil.Hoʻohana maʻamau ia me ke kiʻi ʻoniʻoni uhi uhi thermosetting ma ka ʻoihana papa ʻo Flexible Printed Circuits boards, e hōʻike ana i ke kūpaʻa wela kiʻekiʻe a me ka hana insulation.ʻO 288 ℃ ka mahana kūʻai kūʻai me ka ʻole o nā bula a me ka delamination.Loaʻa iā mākou nā huahana pūʻulu piha o ka PI base FCCL a me ka polyimide thermosetting coverlay a me ka polyimide stiffener sheet, hiki ke hāʻawi i nā hoʻonā ʻoihana no ka hui FPC Board a i ʻole nā mea kūʻai wela a me nā ʻoihana hana insulation uila.

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Huahana Huahana

Nā hiʻohiʻona:

1. ʻO ke kūpaʻa shear maikaʻi

2. He 288 ℃ ka mahana kū'ai kū'ai

3. Paʻa kemika maikaʻi loa,

4. Ke kū'ē i ka lā'au,

5. Ke kū'ē i ka solvent a me ka anti-corrosion

6. E maʻalahi e make-ʻoki ʻia i kekahi hoʻolālā ʻano maʻamau

7. Kiʻekiʻe papa uila insulation

8. Hoʻopili wela wela

9. Hoʻopau maʻemaʻe, ʻaʻohe ʻōhū a me ka delamination

Hoʻopili pinepine ʻia ka papa kaapuni FPC me ka thermosetting adhesivekiʻiʻoniʻoniapolyimide stiffenerpāpaʻi.ʻO ka mea hoʻopili thermosettingkiʻiʻoniʻoniis me ka viscosity oiaipaʻa i ka mahana maʻamau, akā i ka piʻi ʻana o ka mahana i kekahilaula, e hoʻololi ia i kahi kūlana semi-solidified me ka viscosity ikaika.I kēia manawa, e hoʻopili ʻo FPC i kapolyimide stiffenerpāpaʻi.ʻO ka hana maʻamau ka hoʻohālikelike ʻana i kaPI ʻoʻoleʻa kūpono i kahi ʻākaukūlana, a hoʻohana i ka uilakūʻai ʻanahao no 1~2 kekona ihooponopono i kakūlana kiko hoʻokahin.Ma hope o ka wela kiʻekiʻe a me ke kaomi kiʻekiʻeana, ka ili holookoaepili loa,alailakālua ʻanake kiʻiʻoniʻoni e hoʻōla i ka mea hoʻopili.