Ihe nkiri Copper Clad Polyimide Single Side FCCL Mpempe akwụkwọ maka Mgbakọ Board FPC

Nkọwa dị mkpirikpi:

Ihe nkiri Copper Clad Polyimidena-eji ihe nkiri amber ma ọ bụ polyimide ojii dị ka ihe nkiri ntọala ma tinye ya na teepu foil ọla kọpa.A na-ejikarị ya na ihe nkiri mkpuchi ọkụ na-agbanwe agbanwe na ụlọ ọrụ bọọdụ sekit na-agbanwe agbanwe, na-egosipụta ezigbo nguzogide okpomọkụ yana ịrụ ọrụ mkpuchi.The soldering eguzogide okpomọkụ bụ 288 ℃ na-enweghị egosipụta na delamination.Anyị nwere ngwaahịa ngwaahịa zuru oke nke PI base FCCL na polyimide thermosetting coverlay na polyimide stiffener mpempe akwụkwọ, nke nwere ike inye azịza ọkachamara maka mgbakọ FPC Board ma ọ bụ nguzogide okpomọkụ na ụlọ ọrụ mkpuchi ọkụ eletrik.

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Nkọwa ngwaahịa

Mkpado ngwaahịa

atụmatụ:

1. Ezigbo iguzogide ihe

2. soldering eguzogide okpomọkụ bụ 288 ℃

3. Magburu onwe chemical kwụsie ike,

4. Nguzogide radieshon,

5. Chemical mgbaze eguzogide na mgbochi corrosion

6. Ọ dị mfe ịnwụ na-egbutu n'ụdị ọdịdị omenala ọ bụla

7. Igwe ọkụ eletrik dị elu

8. Thermosetting nrapado

9. Ngwunye dị nro, enweghị afụ na delamination

A na-ejikọ bọọdụ sekit na-agbanwe agbanwe FPC na nrapado thermosettingihe nkirinapolyimide siri ikeefere.The thermosetting nrapadoihe nkiriis na-enweghị viscosity mgbesiri ike na okpomọkụ nkịtị, ma mgbe okpomọkụ na-ebili na ụfọdụoke, ọ ga-agbanwe n'ime ọkara siri ike nke nwere viscosity siri ike.N'oge a, FPC ga-arapara na yapolyimide siri ikeefere.Omume n'ozuzu bụ ịkwado nkePI siri ike dabara na aka nriọnọdụ, ma jiri ọkụ eletrikire ereígwè maka 1 ~ 2 sekọnd kadozie nkeotu ebe position.Mgbe elu okpomọkụ na elu pịaing, elu dumga-abụnjikọ zuru oke,mgbe ahụime achịchaihe nkiri ahụ iji gwọọ nrapado.