Single Side Thermal Release Tape for Semi Conductor Chip Temporary Fixation

Short Description:

Thermal Release Tape uses polyester film as carrier and coated with special acrylic adhesive. With unique adhesive, the tape can adheres to the components tightly at room temperature, and the components can be easily peel off without any residue after heating the tape to 110-130℃. Thermal Release Tape is widely used as a temporary fixation during the manufacturing process of Semi Conductor Chip, Electronic Chips, Glass Screen, Battery Housing Shell.

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Features

1. Polyester film with special acrylic adhesive

2. Strong adhesion at room temperature, and easily to be peeled off after heating

3. Available to select temperatures for releasing.

4. No residue on the product surface after peel of

5. Temporary fixing the electronic components during manufacturing process

6. Single side and double side thermal release for option

Thermal release tape has a certain viscosity at room temperature and can be used to temporary fixing the electronic components during manufacturing process. After processing, it only needs to be heated by the set temperature(110-130Celsius) for 3-5 minutes, and the viscosity will disappear automatically, and the tapes can be easily to be peeled off without any residue on the product surface. It improves the production efficiency of electronic components to save the manpower and material resources during the automatic production of Semi Conductor components, Electronic Chips, Glass Screen, Battery Housing Shell, etc,.

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