I-Single Side Thermal Release Tape ye-Semi Conductor Chip Ukulungiswa Kwesikhashana

Incazelo emfushane:

I-Thermal Release Tapeisebenzisa ifilimu ye-polyester njengesithwali futhi ihlanganiswe nge-adhesive ekhethekile ye-acrylic.Nge-adhesive eyingqayizivele, i-tape inganamathela ezingxenyeni ngokuqinile ekamelweni lokushisa, futhi izingxenye zingaxebuka kalula ngaphandle kwanoma iyiphi insalela ngemva kokushisa itheyipu ku-110-130 ℃.I-Thermal Release Tape isetshenziswa kabanzi njengendlela yokulungiswa kwesikhashana phakathi nenqubo yokukhiqiza i-Semi Conductor Chip, Electronic Chips, Glass Screen, Battery Housing Shell.

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Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Izici

1. Ifilimu ye-polyester ene-adhesive ekhethekile ye-acrylic

2. Ukunamathela okuqinile ekamelweni lokushisa, futhi kulula ukuxebuka ngemva kokushisa

3. Iyatholakala ukuze ukhethe amazinga okushisa azokhishwa.

4. Azikho izinsalela endaweni yomkhiqizo ngemuva kwekhasi lika

5. Ukulungiswa kwesikhashana kwezingxenye ze-elekthronikhi phakathi nenqubo yokukhiqiza

6. Uhlangothi olulodwa kanye nokukhishwa okushisayo okuphindwe kabili kokukhethwa kukho

Itheyiphu yokukhishwa kwe-thermal ine-viscosity ethile ekamelweni lokushisa futhi ingasetshenziswa ukulungisa isikhashana izingxenye ze-elekthronikhi phakathi nenqubo yokukhiqiza.Ngemuva kokucubungula, idinga kuphela ukushiswa izinga lokushisa elibekiwe (110-130Celsius) imizuzu engu-3-5, futhi i-viscosity izonyamalala ngokuzenzakalelayo, futhi amateyipu angahlungwa kalula ngaphandle kwanoma iyiphi insalela endaweni yomkhiqizo.Ithuthukisa ukusebenza kahle kokukhiqizwa kwezingxenye ze-elekthronikhi ukuze kugcinwe abasebenzi kanye nezinsizakusebenza ngesikhathi sokukhiqiza okuzenzakalelayo kwezingxenye ze-Semi Conductor, ama-Electronic Chips, isikrini se-Glass, i-Battery Housing Shell, njll,.

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