Dexerials Sony D3451 / D3450 Thermosetting Adhesive Tapes for FPC

Short Description:

Dexerials D3451 and D3450 are white, carrier-free acrylic/epoxy thermosetting adhesive tapes specifically designed for Flexible Printed Circuit (FPC) applications. Offering high peel strength, low resin bleed, and outstanding reflow solder resistance after moisture exposure, D3451 and D3450 are ideal for securing backing materials (such as polyimide, polyester, and epoxy-glass) and terminal boards, ensuring robust structural integrity and reliability in advanced electronics.

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Dexerials Sony D3451 / D3450 Thermosetting Adhesive Tapes for FPC

Features

1. Heat Resistant: Highly resistant to solder reflow temperatures, even after moisture absorption.

2. Fast Curing: Features a rapid cure time to optimize production efficiency. Perfect for hot press, quick press, and oven-curing methods.

3. Convenient Storage: Can be stored at room temperature for hassle-free handling.

4. Initial Tackiness: Provides an initial tack to allow easy and accurate tentative positioning of components.

Product name	D3450	D3451
Main component	Acrylic/Epoxy base	Acrylic/Epoxy base
carrier	Non-carrier	Non-carrier
Color	White	White
Adhesive thickness (µm)	About 35	About 25
Release film thickness(µm)	About 38	About 38
Release paper thickness (µm)	About 130	About 130
Bonding strength (N/10mm)	31	25
size (width & length)	500mm x100m	500mm x100m
Warranty period from manufacturing date	6 months	6 months

90 peeling strength to polyimide
Recommended curing conditions:
1. Quick press
(Temperature / 160°C to 180°C Time/1 min to 2 min(vacuum time / 10 sec to 30 sec), Pressure/1MPa to 2MPa)
Oven curing: (60 min at 140°C)
2. Press
(160°C, 60 min, 3MPa)

Applicaiton:

1. FPC reinforcement and stiffener bonding

2. Fixing terminal boards and supporting substrates in compact electronic devices