Copper Clad Polyimide Firimu Imwe Side FCCL Sheet yeFPC Board Assembly

Copper Clad Polyimide Firimu Rimwechete Side FCCL Sheet yeFPC Board Assembly Inoratidzwa Mufananidzo

Tsanangudzo Pfupi:

Copper Clad Polyimide Firimuinoshandisa amber kana nhema polyimide firimu sebhaisikopo firimu uye yakaputirwa nemhangura foil tepi.Inowanzo shandiswa pamwe chete neiyo thermosetting yekuvharira firimu paFlexible Printed Circuits boards indasitiri, inoratidzira yakanakisa tembiricha yekudzivirira uye kuita kwekudzivirira.Tembiricha yekupikisa inotengeswa ndeye 288 ℃ isina mabhuru uye delamination.Tine zvizere zvakatevedzana zvigadzirwa zvePI base FCCL uye polyimide thermosetting coverlay uye polyimide stiffener sheet, iyo inogona kupa mhinduro dzehunyanzvi dzeFPC Board musangano kana kumwe kupikisa kupisa uye indasitiri yekugadzira magetsi.

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Product Detail

Product Tags

Features:

1. Good shear resistance

2. Soldering resistance tembiricha i288℃

3. Yakanakisa kugadzikana kwemakemikari,

4. Kuramba kwemwaranzi,

5. Chemical solvent resistance uye anti-corrosion

6. Zviri nyore kufa-kucheka mune chero chimiro chetsika chimiro

7. High class magetsi ekudzivirira

8. Thermosetting adhesive

9. Kupera kwakapfava, hapana mabubbles uye delamination

FPC inoshanduka redunhu bhodhi rinowanzo kusungirirwa ne thermosetting adhesivefilmuyepolyimide stiffenerndiro.Iyo thermosetting adhesivefilmis pasina viscosity apoyakasimba pane yakajairika tembiricha, asi kana tembiricha yakwira kune imwerange, ichachinja kuita semi-solidified state ine viscosity yakasimba.Panguva ino, FPC inonamatira kunepolyimide stiffenerndiro.Iyo yakajairika tsika ndeyekugadzirisa iyoPI stiffener kukodzera kurudyichinzvimbo, uye kushandisa magetsisolderingsimbi kwe 1 ~ 2 masekondi kusvikagadzirisasingle point position.Mushure mekupisa kwakanyanya uye kudzvanya kwakanyanyaing, pamusoro pesezvaizovakubatana zvachose,zvinokubikaiyo firimu kurapa adhesive.