Copper Clad Polyimide Zaj duab xis Ib Sab FCCL Sheet rau FPC Board Assembly

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Copper Clad Polyimide Zaj duab xissiv amber lossis dub polyimide zaj duab xis ua zaj duab xis puag thiab plated nrog tooj liab ntawv ci daim kab xev.Nws feem ntau yog siv ua ke nrog thermosetting coverlay zaj duab xis ntawm Flexible Printed Circuits boards kev lag luam, featuring zoo heev kub tsis kam thiab rwb thaiv tsev kev ua tau zoo.Lub soldering kuj kub yog 288 ℃ tsis muaj npuas thiab delamination.Peb tau ua tiav cov khoom lag luam ntawm PI puag FCCL thiab polyimide thermosetting coverlay thiab polyimide stiffener ntawv, uas tuaj yeem muab cov kev daws teeb meem rau FPC Board los yog lwm yam kub tsis kam thiab hluav taws xob rwb thaiv tsev tsim kev lag luam.

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Khoom cim npe

Nta:

1. Zoo shear kuj

2. Soldering kuj kub yog 288 ℃

3. Zoo heev tshuaj stability,

4. Kev tiv thaiv hluav taws xob,

5. Tshuaj hnyav ua haujlwm thiab tiv thaiv corrosion

6. Yooj yim rau tuag-txiav nyob rau hauv tej kev cai zoo tsim

7. High class hluav taws xob rwb thaiv tsev

8. Thermosetting nplaum

9. Smooth tiav, tsis muaj npuas thiab delamination

FPC yooj ywm Circuit Court board feem ntau yog sib txuas nrog thermosetting nplaumzaj duab xisthiabpolyimide stiffenerphaj.Thermosetting nplaumzaj duab xisis tsis muaj viscosity thaumkhoom ntawm qhov kub thiab txias, tab sis thaum kub nce mus rau ib qhontau, nws yuav hloov mus rau hauv ib lub xeev semi-solidified nrog muaj zog viscosity.Lub sijhawm no, FPC yuav lo rau ntawmpolyimide stiffenerphaj.Kev xyaum dav dav yog los ua kom haumPI khoom haum rau txoj caitxoj hauj lwm, thiab siv hluav taws xobsolderinghlau rau 1 ~ 2 vib nas thiskho covib qho point position.Tom qab kub kub thiab siab xovxwmhauv, tag nrho saum npooyuav yogkev sib raug zoo tag nrho,cescizaj duab xis los kho cov nplaum.