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  • Heat Curable Adhesive Bonding Sheets for FPC board or Stiffeners

    Short Description:

    Heat Curable Adhesive Bonding Sheets is also known as sheet adhesive, FPC bonding sheet or pure adhesive, which uses modified acrylic adhesive coated on release paper directly. Our adhesive bonding sheet uses flame retardant modified acrylic adhesive which has excellent bonding strength and able to withstand multiple lamination cycles. It’s equivalent to Dupont Pyralux® FR Sheet Adhesive. And it’s mainly used to bond flexible circuit to rigid flex boards, bond the PI stiffeners, or steel sheets etc,. Our adhesive bonding sheet is complied to REACH, ROHS and UL Certificated. The regular thickness is 12um, 15um, 25um, 40um, 50um.


    Product Detail

    Product Tags

    Heat Curable Adhesive Bonding Sheets for FPC board or Stiffeners

    Features

    1. Flame retardant modified acrylic adhesive composition

    2. Excellent bond strength affords high reliability

    3. Able to withstand multiple lamination cycles

    4. Superior in comprehensive performance

    5. Stable flow properties

    6. No refrigeration required for storage

    7. Comply to ROHS, REACH, UL Certificated

     

    Application:

    With excellent bonding strength property, the acrylic adhesive bonding sheet is suitable for the processing of soldering, drilling, punching, and cutting in the application of thermo compression bonding for FPC board, or the bonding for PI, Stainless steel plate, FR4 substrate and other metal plate.

     

    Storage Condition:

    The adhesive bonding sheet should be stored in the original packaging at temperatures of 4 – 29 °C (40 – 85 °F) and below 70% humidity. The product should not be frozen and should be kept dry, clean, and well-protected

     

    Method of Application:

    1. Peel off the first layer release film/paper

    2. Put the adhesive bonding sheet in the correct position to match the material

    3. Then use thermo compression bonding method to bond the material together.

     

    There are two method of thermo compression bonding method:

    1) At the compound, the pyramid-general of the 170 ℃ ~ 180 ℃ / 60minutes, pressure on the 25 ~ 50 Kg/cm2;

    2) At the compound, quickly press in 170 ℃ ~ 180 ℃ / 2 ~ 3 minutes, pressure on the 80 ~ 100 Kg/cm2; then removed from the press Add to oven in the 140 ℃ / 90 minutes after curing.(Multilayer board with glue-free zone process is suitable).


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