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    PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling

    PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling Featured Image
    • PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling
    • PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling
    • PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling
    • PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling

    Short Description:

     

    Low Temperature Release Tape is a temperature-responsive adhesive tape designed for secure bonding at room temperature and clean removal under low-temperature conditions. As the temperature decreases, adhesion gradually drops, allowing easy, residue-free peeling without damaging the bonded surface.

    Compared with UV or thermal release tapes, it enables release simply by cooling, without the need for additional equipment, offering a more efficient and cost-effective solution.

    Based on a PET film backing, it is available in single-sided or double-sided constructions and suitable for both manual and automated processing. Customizable thickness, adhesion, and release temperature make it ideal for electronics, semiconductor, and precision processing applications.


    Product Detail

    Product Tags

    PET Low Temperature Release Tape for Temporary Fixing with Residue-Free Peeling

    Features

    (1) Optional structure: PET film backing with single-sided or double-sided pressure sensitive adhesive options.

    (2) Strong initial tack: reliable bonding at room temperature.

    (3) No equipment required: no UV or heating process needed.

    (4) Clean removal: no adhesive residue after peeling.

    (5) Excellent die-cutting performance: suitable for precision processing.

    (6) Reverse Temperature Control: Different from traditional thermal release tape, adhesion drops at low temperatures without heating, making it ideal for heat-sensitive applications.

    (7) Fully Customizable: thickness, size, initial adhesion, and release temperature can be tailored to meet diverse application requirements across industries.

     

    Application: 

    Electronics & Semiconductor Industry

    Suitable for temporary bonding of wafers, chips, and precision electronic components. The tape ensures stable fixation during assembly and processing, with clean removal at low temperatures to avoid thermal stress and residue.

    Precision Processing

    Ideal for holding fragile materials such as glass, ceramics, and optical components during grinding, cutting, or machining. Optimized adhesion reduces the risk of damage, while low-temperature release allows easy removal for subsequent operations.

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