Black Graphene Thermal Conductive Film for Electronics Heat Dissipation

Features

1. In-plane thermal conductivity up to 1000-2000W/(m·K), heat dissipation efficiency far exceeding traditional materials

2. Supports roll supply with customizable length, suitable for mass continuous production

3. Offers precise die-cut customization to meet irregular heat dissipation needs of various devices

4. Ultra-thin design (10-300μm) without occupying extra device space

5. Excellent flexibility, resistant to 100,000 bends, suitable for foldable/curved devices

6. Lightweight feature with low density, no additional load on end products

7. Wide operating temperature range (-40℃~200℃), adaptable to extreme environments

8. Stable chemical properties, corrosion-resistant and oxidation-resistant with long service life

9. No electromagnetic interference (EMI), no impact on electronic device signal transmission

10. Environmentally friendly and non-toxic, complying with RoHS and other environmental standards during production and use

Application: 

Graphene Thermal Conductive Film is a high-performance thermal management material with ultra-high in-plane thermal conductivity, excellent flexibility, and ultra-thin design. It is widely used in various industrial applications due to its superior heat dissipation efficiency, mechanical robustness, and adaptability to miniaturized devices. Its characteristics of high thermal conductivity, flexibility, processability, and environmental friendliness make it ideal for demanding thermal management projects. It can integrate into multiple components and systems, ensuring reliable heat dissipation performance in complex working environments.

Application Industry:

• Consumer Electronics (smartphone heat dissipation, foldable screen thermal management, laptop/tablet CPU/GPU cooling)
• New Energy Vehicles (power battery thermal management, electric control system heat dissipation, motor controller cooling)
• Communication & Data Centers (5G base station equipment cooling, AI server cluster heat dissipation, high-density network device thermal management)
• Medical Devices (wearable medical device heat dissipation, precision medical instrument thermal control)
• Aerospace (lightweight thermal management for aerospace equipment, satellite component cooling)
• LED Lighting (LED chip heat dissipation, high-power lighting fixture thermal control)