Itheyiphu yokukhupha iThermal kwicala elinye leSemi Conductor Chip uLungiso lwexeshana

ITape yokuKhululwa kweThermal ekwicala elinye yeSemi Conductor Chip uLungiso lweThutyana loMfanekiso obonakalayo

Inkcazelo emfutshane:

I-Thermal Release Tapeisebenzisa ifilimu yepolyester njengomphathi kwaye igqunywe nge-adhesive ekhethekileyo ye-acrylic.Nge-adhesive ekhethekileyo, i-tape inokubambelela kumacandelo ngokuqinileyo kwiqondo lokushisa, kwaye amacandelo anokuthi ahlanjululwe ngokulula ngaphandle kwentsalela emva kokufudumeza i-tape kwi-110-130 ℃.I-Thermal Release Tape isetyenziswa ngokubanzi njengokulungiswa kwexeshana ngexesha lokwenziwa kwenkqubo yokuvelisa i-Semi Conductor Chip, i-Electronic Chips, i-Glass Screen, i-Battery Housing Shell.

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Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimbonakalo

1. Ifilimu yepolyester ene-adhesive ekhethekileyo ye-acrylic

2. Ukubambelela okuqinileyo kwiqondo lokushisa, kwaye kulula ukuxothwa emva kokufudumeza

3. Iyafumaneka ukukhetha amaqondo obushushu ukukhulula.

4. Akukho ntsalela kumphezulu wemveliso emva kwexolo le

5. Ukulungisa okwethutyana amacandelo e-elektroniki ngexesha lenkqubo yokuvelisa

6. Icala elinye kunye necala eliphindwe kabini lokukhululwa kwe-thermal ukhetho

I-tape yokukhupha i-Thermal ine-viscosity ethile kwiqondo lokushisa kwaye ingasetyenziselwa ukulungiswa okwethutyana amacandelo e-elektroniki ngexesha lenkqubo yokuvelisa.Emva kokucutshungulwa, kufuneka ifudunyezwe kuphela ngubushushu obubekiweyo (110-130Celsius) imizuzu emi-3-5, kwaye i-viscosity iya kunyamalala ngokuzenzekelayo, kwaye iiteyipu zinokucocwa ngokulula ngaphandle kwentsalela kwindawo yemveliso.Iphucula ukusebenza kakuhle kwemveliso yamacandelo e-elektroniki ukugcina abasebenzi kunye nezixhobo eziphathekayo ngexesha lokuveliswa ngokuzenzekelayo kweeSemi Conductor components, i-Electronic Chips, iGlass Screen, iShell yeNdlu yeBattery, njl.

Ishishini eliNikiweyo:

Isetyenziselwa ukusetyenzwa kwamacandelo achanekileyo kunye nokumiswa okwethutyana
Ukulungiswa okwethutyana kunye nokumiswa kweSemi Conductor Components
Ukubeka amacandelo ebhodi yesekethe
Ukulungiswa kwexeshana kunye nokubekwa kwesikrini seglasi
I-Silicon wafer yokusila kunye nokubeka indawo
Isikhundla se-MLCC/MLCK Slitting
Ukusika i-nameplate yesiphelo esiphezulu, njl
Ukulungiswa okwethutyana kunye nokumiswa kwebhetri yeLithium